ISAAT 2023(The 25th International Symposium on Advances in Abrasive Technology)  

2023國際先進磨粒加工技術研討會

台灣磨粒加工學會2023年會暨精密加工技術研討會

ISAAT 2023 徵稿開始 

ISAAT 2023 (The 25th International Symposium on Advances in Abrasive Technology)  

Conference Date : 2023/12/10-2023/12/13

Venue: Taichung Taiwan

活動網址: https://im.ncut.edu.tw/p/426-1004-5.php 

【Call for Papers】

Submit for ISAAT proceeding

Authors will be provided the options to submit their papers to ISAAT proceedings only, or to both  ISAAT proceedings and the International Journal of Abrasive Technology (IJAT, EI indexed).

Abstract submission to ISAAT: The abstract must include paper title, authors and their affiliations, and a summary of the paper within 200 words.

Full ISAAT papers must be written in English of length from 4 to 6 proceedings pages.

The version of the paper submitted to the IJAT should be at least 6 ISAAT proceedings Pages.

Each paper must be formatted and submitted according to the Instructions for Authors available in the conference website. 

Author Template Abstract ISAAT 2023

Author Template ISAAT 2023 

ISAAT Paper Submission：Click here 

IJAT Paper Submission：Click here 

2023先進材料製造技術論壇 

會議時間：112年11月21日(星期二) 09:00-17:00
會議地點：國立勤益科技大學圖書資訊館6樓會議廳

收費方式：難削材加工技術與製程開發產學聯盟會員廠商免報名費。

非以上單位收費1000元/人(採現場收費)。

報名網址：https://reurl.cc/edDDKK

報名期限：111年11月15日 17:00報名截止

112.03.08 精密與智慧化磨粒加工趨勢研討會

2022台灣磨粒加工學會年會暨精密加工技術研討會

【邀請投稿】Surface and Interface Metrology in Semiconductor Manufacturing

轉發” Surface Topography: Metrology and Properties”期刊特輯” Surface and Interface Metrology in Semiconductor Manufacturing”徵稿資訊，歡迎有研究心得的先進參考投稿！

Surface and Interface Metrology in Semiconductor Manufacturing

Call for Papers

Scope

As semiconductor manufacturers attempt to move beyond the Moore's law, metrology challenges arise to provide accuracy and precision for shrinking of feature sizes with 3D complexity architecture, such as gate-all-around devices. There are many process steps from preparation of wafers through to production of packaged devices, each with specific requirements for 3D critical dimensions, surface and surface and interface properties, finish and functionalization, and cumulative effects on yield. Surface metrology, including optical, contact, electrical, mechanical, and even virtual metrology, is vital throughout the process steps.

This special issue aims to present both the state of the art and the future direction of surface and interface metrology in advanced semiconductor manufacturing. Your contribution is most welcome.

Guest Editors

林增耀 執行長     / 工業技術研究院 量測技術發展中心

陳炤彰 副執行長 / 工業技術研究院 量測技術發展中心；特聘教授  / 台灣科技大學機械工程系

傅尉恩 組長         / 工業技術研究院 量測技術發展中心

截稿日期

2022年10月31日

投稿方式

本期特刊連結：Surface and Interface Metrology in Semiconductor Manufacturing - Surface Topography: Metrology and Properties - IOPscience

投稿頁面連結: https://mc04.manuscriptcentral.com/stmp-iop (manuscript type請選擇Special Issue article，然後在選單中選取Surface and Interface Metrology in Semiconductor Manufacturing)

ISAAT 2022 (The 24rd International Symposium on Advances in Abrasive Technology)  

日期: 2022/12/09-2022/12/12

地點:廣東工業大學

活動網址: https://isaat2022.scimeeting.cn/en/web/index/13768 

【轉呈台灣電加工學會活動】

台灣電加工學會 第七屆論文獎開始徵稿囉

相關投稿訊息請至 台灣電加工學會網站:https://www.tseme.org.tw/news_detail.asp?id=88